Universal Robots (UR) has announced a new imitation learning system designed to accelerate the development of AI‑driven robotics, unveiling the UR AI Trainer at GTC 2026.

The modules are designed for power‑conversion systems operating in harsh industrial and renewable‑energy environments, where long‑term durability and high reliability are critical. The BZPACK family ...

Imec has taken delivery of the ASML EXE:5200 High Numerical Aperture (High NA) EUV lithography system, the most advanced tool of its kind currently available. ASML latest NA EUV lithography system ...

DigiKey has introduced an upgraded version of eDesignSuite, developed in collaboration with STMicroelectronics (ST) and Ultra Librarian, offering engineers a more streamlined and connected workflow ...

Mark Najarian from Thermo Fisher Scientific, talks to Neil Tyler about the company's role in semiconductor fabrication.

For years, South Korea’s leading memory manufacturers, including Samsung and SK Hynix, have preferred shorter quarterly or annual agreements, especially in periods when supply w ...

TE Connectivity has unveiled its new 56G MezzaWave connector and cable assembly range to meet growing data demands.

NXP Semiconductors has introduced its latest automotive radar transceiver, a high‑integration device designed to support imaging radar systems for Level 2+ to Level 4 advanced driver assistance and ...

STMicroelectronics announces new steps to accelerate the development and deployment of physical AI systems worldwide.

STMicroelectronics has introduced a new monolithic buck converter designed to deliver 3A of output current from an ultra‑compact package, targeting applications ranging from smart meters and home ...

Marvell introduces the Structera S 30260, a next‑generation CXL switch designed to enable rack‑level memory pooling.

Keysight Technologies has introduced a new emulation and analytics platform designed to help organisations validate and optimise AI inference workloads across large‑scale data‑centre environments. AI ...