HBM shortages threaten AI expansion; TSMC weighs price hikes; advanced packaging ramps; domain-specialized AI models; ...

Technology is only useful if it improves an existing methodology. Property generation is still refining that goal, but in the ...

Shift left is becoming less linear. Instead of locking down specifications early, design teams may be able to refine ...

This is the third article in a series examining what it takes to build production-ready AI agents for EDA. The first explored the architectural decisions required for agents to operate reliably in ...

Solving difficult bugs while intelligently deciding what to investigate, what to rerun, and where to spend compute.

Physics-based analysis becomes more consequential as chips, packages, boards, and systems are designed together.

Advanced packaging requires models to cross company boundaries without exposing proprietary processes, but hiding too much ...

STCO for heterogeneous design; physical AI interactions; signing off AI-generated designs; workload profile analysis.

The explosive growth of cloud computing and AI – from generative, and reasoning, to (ultimately) agentic systems – is creating unprecedented demand for bandwidth, as the amount of data that must be ...