STMicroelectronics claims first IMU with dual MEMS accelerometer and embedded AI with impact detection up to 320 g.

NXP’s NTAG X DNA connected NFC tag, compatible with any NFC mobile device, combines high-density memory and a high data rate.

The next wave of smart home innovations will come with a shift toward on-device AI, small language models, and multimodal ...

Circuit protection manufacturers boost performance and deliver smaller footprints for applications ranging from vehicles to ...

Smart home innovation requires reliable multi-protocol connectivity, advanced sensing, and efficient on-device inferencing.

Silicon Labs launches its first Series 3 wireless SoCs, built on the 22-nm process node, targeting line-powered and ...

Bourns’ SRP2512CL and SRP3212CL power inductors deliver reduced losses and high efficiency to meet DDR5 memory specifications ...

NXP’s OrangeBox 2.0 automotive development platform integrates AI, post-quantum cryptography, and SDN for secure ...

The U.S. Cyber Trust Mark, announced by the U.S. government on Aug. 10, 2023, represents a landmark moment for IoT security.

AIoT and edge computing are re-engineering urban life to build smarter cities that are safer, more sustainable, and highly ...

Innatera’ neuromorphic MCU delivers smart and efficient intelligence to battery-powered devices for ultra-low-power AI at the ...

Infineon launches the PSOC 4100T Plus multi-sensing MCUs with advanced sensing capabilities, enhanced reliability, and new ...