Abstract: The bonding methods of ceramic / metal in vacuum electronic devices can be divided into two ways: with solder and without solder. Among them, the way with solder has been relatively mature, ...
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Abstract: Fatigue-induced delamination of the direct-bonded copper (DBC) solder layer is a critical and latent failure mode in multichip Insulated Gate Bipolar Transistor (IGBT) power modules. To ...
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