xMEMS is bringing its µCooling fan-on-chip platform to AI-driven extended reality (XR) smart glasses. The silicon-based solid ...

EPC Space has announced the EPC7030MSH, a radiation-hardened 300-V GaN FET for high-voltage, high-power space applications.

ST’s L9800 combines eight low-side drivers with diagnostics and protection in a compact leadless package for tight automotive ...

Microchip has added secure code signing, FOTA updates, and CRA compliance to its ECC608 TrustMANAGER authentication IC.

There are numerous evergreen chips in the semiconductor industry, and this blog provides a sneak peek at some of these ...

Using the Take Back Half approach to effectively “take back” the error terms for theoretically zero integral nonlinearity.

Wafer-scale accelerators for AI applications can deliver far more computing power with much greater energy efficiency.

How much would you pay for a limited-edition new wearable product? If you’re anything like this engineer: a pretty penny.

First, the company’s Innovator3D IC suite enables chip designers to efficiently author, simulate, and manage heterogeneously ...

Using a reconfigured common-mode choke as an isolation transformer to analyze the open-loop response of a Peltz oscillator.

Understanding the technology and supporting ecosystem is necessary before chiplets begin to see widespread adoption.

Elaborating on a Flip ON Flop OFF circuit with a circuit that allows for a multi-state 10-position switch or a DAC.