Advanced packaging, AI/HPC, 5G and EV chips are driving demand for ultra-fine-pitch, high-frequency and high-power probes, creating opportunities in precision materials and localized supply.Dublin, ...

DediProg Technology Co., Ltd., a global provider of IC programming and test socket solutions, today announced that it will showcase its latest UltraConduct™ Rubber Pin Socket for advanced AI and HPC ...

Opinions expressed by Digital Journal contributors are their own. The semiconductor industry is experiencing rapid growth, driven by increasing demand for computers, automobiles, mobile phones, ...

Testing house King Yuan Electronics (KYEC) is expected to budget a higher capex for 2021 than NT$8.5 billion (US$301.8 million) in 2020 to meet robust testing orders for 5G chips from... Taiwan-based ...

The multi-year partnership gives chip developers access to Teradyne’s advanced test systems as increasingly complex AI and ...

In the fast-paced world of semiconductor manufacturing, achieving higher yields and reducing costs are constant challenges. Ideally, yield should only be impacted by unavoidable defects when ...

The types of devices being deployed in cars and how they differ in functionality. Why each device type requires a different test technique. Determining the best approach for the specific application.

Hello. I am Koichi Kamiya, a corporate analysis specialist.This time, I have produced a corporate analysis video on Advantest ...

India's semiconductor policy is moving towards a broader ecosystem covering design, manufacturing and talent. Packaging, OSAT ...

Rapidly increasing chip and package complexity, coupled with an incessant demand for more reliability, has triggered a frenzy of alliances and working relationships that are starting to redefine how ...

AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from ...