The projects are spearheaded by startups and MSMEs, focusing on applications ranging from surveillance cameras and energy ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

The National Science and Technology Council (NSTC) is set to implement the Taiwan Chip-driven Industrial Innovation Program (TCIIP) in January 2024, a collaborative effort with various government ...